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HM9-6533-9

Intersil Corporation

Intersil Corporation HM9-6533-9
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-XDFP-F20
  • Memory Width
    4
  • Organization
    1KX4
  • Package Code
    DFP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • Memory Density
    4096 bit
  • Memory IC Type
    STANDARD SRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1.27 mm
  • Access Time-Max
    400 ns
  • Number of Words
    1024 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Terminals
    22
  • Number of Words Code
    1K
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    FL22,.4
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel

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HM9-6533-9
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HM9-6533-9