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HH80557PG0331M

Intel Corporation

Intel Corporation HH80557PG0331M
  • ECCN
    3A991.A.1
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Speed
    1200 rpm
  • Format
    FLOATING POINT
  • Bit Size
    64
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B775
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Terminal Pitch
    1.1 mm
  • Integrated Cache
    YES
  • Address Bus Width
    33
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    75000 mA
  • Supply Voltage-Nom
    1.2 V
  • Number of Terminals
    775
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • External Data Bus Width
    64
  • Package Equivalence Code
    LGA775,30X33,46/43
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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HH80557PG0331M
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HH80557PG0331M