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GT28F008B3B150

Intel Corporation

Intel Corporation GT28F008B3B150
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Endurance
    10000 Write/Erase Cycles
  • Boot Block
    BOTTOM
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Sector Size
    8K,64K Words
  • Data Polling
    NO
  • JESD-30 Code
    R-PBGA-B48
  • Memory Width
    8
  • Organization
    1MX8
  • Package Code
    VFBGA
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    8388608 bit
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    0.75 mm
  • Access Time-Max
    150 ns
  • Number of Words
    1048576 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • Seated Height-Max
    1 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    BOTTOM BOOT BLOCK
  • Supply Current-Max
    23 mA
  • Number of Functions
    1
  • Number of Terminals
    48
  • Programming Voltage
    3 V
  • Standby Current-Max
    1.0E-5 Amp
  • Number of Words Code
    1M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    YES
  • Number of Sectors/Size
    8,15
  • Package Equivalence Code
    BGA45,6X8,30
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    2.7 V

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GT28F008B3B150
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GT28F008B3B150