GSI Technology, Inc. GS8182T37BGD-400IT | 搜芯易Sourcengine

GSI Technology, Inc. GS8182T37BGD-400IT

生命周期状态
Discontinued
RoHS
符合RoHS标准
REACH
REACH compliant
说明
DDR II Plus SRAM, 512KX36, 0.45ns, CMOS, PBGA165
类别
Semiconductors Memory ICs SRAMs DDR II PLUS SRAM

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
13
Length (mm)
15
JESD-30 Code
R-PBGA-B165
Memory Width
36
Package Code
LBGA
Output Enable
NO
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Memory IC Type
DDR II PLUS SRAM
Operating Mode
SYNCHRONOUS
Number of Ports
1
Parallel/Serial
PARALLEL
Terminal Finish
TIN SILVER COPPER
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Additional Feature
PIPELINED ARCHITECTURE
Memory Organization
512KX36
Number of Functions
1
Number of Terminals
165
Terminal Pitch (mm)
1
Access Time-Max (ns)
0.45
Number of Words Code
512K
Memory Density (bits)
18874368
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.4
Supply Voltage-Max (V)
1.9
Supply Voltage-Min (V)
1.7
Supply Voltage-Nom (V)
1.8
Number of Words (words)
524288
Standby Current-Max (A)
0.185
Standby Voltage-Min (V)
1.7
Supply Current-Max (mA)
575
Package Equivalence Code
BGA165,11X15,40
Clock Frequency-Max (MHz)
400
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40