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GS8161Z18DT-200IT

GSI Technology, Inc.

GSI Technology, Inc. GS8161Z18DT-200IT
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • JESD-30 Code
    R-PQFP-G100
  • Memory Width
    18
  • Package Code
    QFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    ZBT SRAM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Additional Feature
    FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V
  • Memory Organization
    1MX18
  • Number of Functions
    1
  • Number of Terminals
    100
  • Access Time-Max (ns)
    6.5
  • Number of Words Code
    1M
  • Memory Density (bits)
    18874368
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    2.7
  • Supply Voltage-Min (V)
    2.3
  • Supply Voltage-Nom (V)
    2.5
  • Number of Words (words)
    1048576
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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GS8161Z18DT-200IT
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GS8161Z18DT-200IT