GS81284Z18GB-300I
GSI Technology, Inc.
- 生命周期状态Contact Mfr
- RoHS符合RoHS标准
- REACHREACH compliant
- 说明SRAM Chip Sync Dual 2.5V/3.3V 144M-bit 8M x 18 5.5ns/2.3ns 119-Pin FBGA Tray
- 类别
- ECCN3A991.b.2.a
- ECCN GovernanceEAR
- HTS Code8542.32.00.41
- SB Code8542.32.00.40
- TechnologyCMOS
- Width (mm)14
- Length (mm)22
- JESD-30 CodeR-PBGA-B119
- Memory Width18
- Package CodeBGA
- Package ShapeRECTANGULAR
- Package StyleGRID ARRAY Meter
- Surface MountYES
- Terminal FormBALL
- J-STD-609 Codee1
- Memory IC TypeZBT SRAM
- Operating ModeSYNCHRONOUS
- Parallel/SerialPARALLEL
- Terminal FinishTIN SILVER COPPER
- DLA QualificationNot Qualified
- Temperature GradeINDUSTRIAL
- Terminal PositionBOTTOM
- Additional FeatureFLOW-THROUGH OR PIPELINED ARCHITECTURE;ALSO OPERATES WITH 3.3V
- Memory Organization8MX18
- Number of Functions1
- Number of Terminals119
- Terminal Pitch (mm)1.27
- Access Time-Max (ns)5.5
- Number of Words Code8M
- Memory Density (bits)150994944
- Package Body MaterialPLASTIC/EPOXY
- Seated Height-Max (mm)1.99
- Supply Voltage-Max (V)2.7
- Supply Voltage-Min (V)2.3
- Supply Voltage-Nom (V)2.5
- Number of Words (words)8388608
- Moisture Sensitivity Level3
- Peak Reflow Temperature (Cel)260
- Operating Temperature-Max (Cel)85
- Operating Temperature-Min (Cel)-40
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GS81284Z18GB-300I