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GS4576C09GM-18T

GSI Technology, Inc.

GSI Technology, Inc. GS4576C09GM-18T
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.32
  • SB Code
    8542.32.00.15
  • Width
    11 mm
  • Length
    18.5 mm
  • Technology
    CMOS
  • Access Mode
    MULTI BANK PAGE BURST
  • JESD-30 Code
    R-PBGA-B144
  • Memory Width
    9
  • Organization
    64MX9
  • Package Code
    LBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    603979776 bit
  • Memory IC Type
    DDR DRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Number of Ports
    1
  • Number of Words
    67108864 words
  • Seated Height-Max
    1.25 mm
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO REFRESH
  • Number of Functions
    1
  • Number of Terminals
    144
  • Number of Words Code
    64M
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    95 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    1.9 V
  • Supply Voltage-Min (Vsup)
    1.7 V
  • Supply Voltage-Nom (Vsup)
    1.8 V
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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GS4576C09GM-18T
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GS4576C09GM-18T