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FM22L16-55-TGTR

Cypress Semiconductor Corporation

FM22L16-55-TGTR 产品规格书
Cypress Semiconductor Corporation FM22L16-55-TGTR
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • Width (mm)
    10.16
  • Length (mm)
    18.41
  • JESD-30 Code
    R-PDSO-G44
  • Memory Width
    16
  • Package Code
    TSOP2
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    FRAM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Pure Tin (Sn)
  • Terminal Position
    DUAL
  • Additional Feature
    DATA RETENTION TIME @ 85 DEGREE CENTIGRADE;2.5KV ESD AVAILABLE;ALSO CONFIGURABLE AS 512KX8
  • Memory Organization
    256KX16
  • Number of Functions
    1
  • Number of Terminals
    44
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    110
  • Number of Words Code
    256K
  • Memory Density (bits)
    4194304
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3.3
  • Data Retention Time-Min
    10
  • Number of Words (words)
    262144
  • Standby Current-Max (A)
    0.00027
  • Standby Voltage-Min (V)
    2.7
  • Supply Current-Max (mA)
    12
  • Package Equivalence Code
    TSOP44,.46,32
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Endurance (Write/Erase Cycles)
    1.0E+14
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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FM22L16-55-TGTR
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FM22L16-55-TGTR