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EWIXP460AE

Intel Corporation

Intel Corporation EWIXP460AE
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.25
  • SB Code
    8542.31.00.25
  • Format
    FIXED POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    35
  • Length (mm)
    35
  • Speed (MHz)
    667
  • JESD-30 Code
    S-PBGA-B544
  • Package Code
    HBGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Low Power Mode
    NO
  • Terminal Finish
    TIN SILVER COPPER
  • Integrated Cache
    YES
  • Address Bus Width
    32
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    544
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.51
  • Supply Voltage-Max (V)
    1.47
  • Supply Voltage-Min (V)
    1.33
  • Supply Voltage-Nom (V)
    1.4
  • External Data Bus Width
    32
  • Package Equivalence Code
    BGA544,26X26,50
  • Clock Frequency-Max (MHz)
    66
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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EWIXP460AE