EPM1270GM256I4

Intel Corporation

Intel Corporation EPM1270GM256I4
  • ECCN
    3A991.d
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.55
  • SB Code
    8542.31.00.55
  • JTAG BST
    YES
  • Technology
    CMOS
  • Width (mm)
    11
  • Length (mm)
    11
  • JESD-30 Code
    S-PBGA-B256
  • Organization
    0 DEDICATED INPUTS, 212 I/O
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Output Function
    MACROCELL
  • Number of Inputs
    212
  • DLA Qualification
    Not Qualified
  • Number of Outputs
    212
  • Terminal Position
    BOTTOM
  • Additional Feature
    YES
  • Number of I/O Lines
    212
  • Number of Terminals
    256
  • Terminal Pitch (mm)
    0.5
  • Number of Macro Cells
    980
  • Package Body Material
    PLASTIC/EPOXY
  • In-System Programmable
    YES
  • Propagation Delay (ns)
    8.1
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Max (V)
    1.89
  • Supply Voltage-Min (V)
    1.71
  • Supply Voltage-Nom (V)
    1.8
  • Programmable Logic Type
    FLASH PLD
  • Package Equivalence Code
    BGA256,20X20,20
  • Number of Dedicated Inputs
    0
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40

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