Intel Corporation EPCQ16SI8N | 搜芯易Sourcengine

Intel Corporation EPCQ16SI8N

生命周期状态
Discontinued
RoHS
符合RoHS标准
REACH
REACH compliant
说明
FPGA Configuration Flash Memory
类别
Semiconductors Memory ICs PROMs

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Type
NOR TYPE
Technology
CMOS
Width (mm)
3.9
Length (mm)
4.9
JESD-30 Code
R-PDSO-G8
Memory Width
8
Package Code
SOP
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory IC Type
CONFIGURATION MEMORY
Operating Mode
SYNCHRONOUS
Parallel/Serial
SERIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Position
DUAL
Memory Organization
2MX8
Number of Functions
1
Number of Terminals
8
Terminal Pitch (mm)
1.27
Number of Words Code
2M
Memory Density (bits)
16777216
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.75
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
2.7
Supply Voltage-Nom (V)
3.3
Data Retention Time-Min
20
Number of Words (words)
2097152
Programming Voltage (V)
3.3
Standby Current-Max (A)
0.0001
Supply Current-Max (mA)
20
Package Equivalence Code
SOP8,2
Clock Frequency-Max (MHz)
133
Peak Reflow Temperature (Cel)
260
Endurance (Write/Erase Cycles)
100000
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Write Cycle Time-Max (tWC) (ms)
8
Time@Peak Reflow Temperature-Max (s)
40