Intel Corporation EPC1441TI32N | 搜芯易Sourcengine

Intel Corporation EPC1441TI32N

生命周期状态
Discontinued
RoHS
符合RoHS标准
REACH
REACH compliant
说明
Configuration SRAM for FBGA
类别
Semiconductors Memory ICs PROMs

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.61
SB Code
8542.32.00.60

Technology
CMOS
Width (mm)
7
Length (mm)
7
JESD-30 Code
S-PQFP-G32
Memory Width
1
Package Code
TQFP
Package Shape
SQUARE
Package Style
FLATPACK, THIN PROFILE Meter
Surface Mount
YES
Terminal Form
GULL WING
J-STD-609 Code
e3
Memory IC Type
CONFIGURATION MEMORY
Operating Mode
SYNCHRONOUS
Parallel/Serial
SERIAL
Terminal Finish
MATTE TIN
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
QUAD
Additional Feature
IT ALSO REQUIRES 5V NOMINAL SUPPLY
Memory Organization
440800X1
Number of Functions
1
Number of Terminals
32
Terminal Pitch (mm)
0.8
Number of Words Code
440800
Memory Density (bits)
440800
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.2
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
3
Supply Voltage-Nom (V)
3.3
Number of Words (words)
440800
Programming Voltage (V)
3.3
Standby Current-Max (A)
6.0E-5
Supply Current-Max (mA)
30
Package Equivalence Code
TQFP32,.35SQ,32
Moisture Sensitivity Level
3
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40