Intel Corporation EPC1213LC20 | 搜芯易Sourcengine

Intel Corporation EPC1213LC20

生命周期状态
Discontinued
REACH
REACH compliant
说明
Configuration SRAM for FBGA
类别
Semiconductors Memory ICs PROMs

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

I/O Type
COMMON
Technology
CMOS
Width (mm)
8.9662
Length (mm)
8.9662
JESD-30 Code
S-PQCC-J20
Memory Width
1
Package Code
QCCJ
Package Shape
SQUARE
Package Style
CHIP CARRIER Meter
Surface Mount
YES
Terminal Form
J BEND
Memory IC Type
CONFIGURATION MEMORY
Operating Mode
SYNCHRONOUS
Parallel/Serial
SERIAL
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Memory Organization
212942X1
Number of Functions
1
Number of Terminals
20
Terminal Pitch (mm)
1.27
Access Time-Max (ns)
75
Number of Words Code
212942
Memory Density (bits)
212942
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
4.572
Supply Voltage-Max (V)
5.25
Supply Voltage-Min (V)
4.75
Supply Voltage-Nom (V)
5
Number of Words (words)
212942
Standby Current-Max (A)
0.0002
Supply Current-Max (mA)
50
Package Equivalence Code
LCC20,.39SQ
Clock Frequency-Max (MHz)
6
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED