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DS33X82+

Analog Devices, Inc.

Analog Devices, Inc. DS33X82+
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    17
  • Length (mm)
    17
  • JESD-30 Code
    S-PBGA-B256
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Telecom IC Type
    SUPPORT CIRCUIT
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    256
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.77
  • Supply Voltage-Nom (V)
    1.8
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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DS33X82+
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DS33X82+