产品制造商
提交询价BOM 工具

CY7C1475BV33-133BGC

Cypress Semiconductor Corporation

Cypress Semiconductor Corporation CY7C1475BV33-133BGC
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Width (mm)
    14
  • Length (mm)
    22
  • JESD-30 Code
    R-PBGA-B209
  • Memory Width
    72
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    ZBT SRAM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    FLOW-THROUGH ARCHITECTURE
  • Memory Organization
    1MX72
  • Number of Functions
    1
  • Number of Terminals
    209
  • Terminal Pitch (mm)
    1
  • Access Time-Max (ns)
    6.5
  • Number of Words Code
    1M
  • Memory Density (bits)
    75497472
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    1.96
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3.135
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    1048576
  • Standby Voltage-Min (V)
    3.14
  • Package Equivalence Code
    BGA209,11X19,40
  • Clock Frequency-Max (MHz)
    133
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

CY7C1475BV33-133BGC有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
CY7C1475BV33-133BGC
提交询价
CY7C1475BV33-133BGC