Cypress Semiconductor Corporation CY7C1380D-167BZCT | 搜芯易Sourcengine

Cypress Semiconductor Corporation CY7C1380D-167BZCT

生命周期状态
EOL
说明
CY7C1380D-167BZCT
类别
Semiconductors Memory ICs

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
13.0000
Length (mm)
15.0000
JESD-30 Code
R-PBGA-B165
Memory Width
36
Package Code
LBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Memory IC Type
STANDARD SRAM
Operating Mode
SYNCHRONOUS
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Additional Feature
PIPELINED ARCHITECTURE
Memory Organization
512KX36
Number of Functions
1
Number of Terminals
165
Terminal Pitch (mm)
1.000
Access Time-Max (ns)
3.4000000000000000
Number of Words Code
512K
Memory Density (bits)
18874368.0000000000000000
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.4000
Supply Voltage-Max (V)
3.60000
Supply Voltage-Min (V)
3.13500
Supply Voltage-Nom (V)
3.3
Number of Words (words)
524288.0000000000000000
Standby Current-Max (A)
0.070000000000000
Supply Current-Max (mA)
275.000000000000000
Package Equivalence Code
BGA165,11X15,40
Clock Frequency-Max (MHz)
167.00000
Moisture Sensitivity Level
3
Operating Temperature-Max (Cel)
70.0
Operating Temperature-Min (Cel)
0.0