CY7C1320BV18-200BZC
Cypress Semiconductor Corporation
- 生命周期状态Discontinued
- 说明SRAM Chip Sync Single 1.8V 18M-bit 512K x 36 0.45ns 165-Pin FBGA Tray
- 类别
- ECCN3A991.b.2.a
- ECCN GovernanceEAR
- HTS Code8542.32.00.41
- SB Code8542.32.00.40
- I/O TypeCOMMON
- TechnologyCMOS
- Width (mm)13.0000
- Length (mm)15.0000
- JESD-30 CodeR-PBGA-B165
- Memory Width36
- Package CodeLBGA
- Package ShapeRECTANGULAR
- Package StyleGRID ARRAY, LOW PROFILE
- Surface MountYES
- Terminal FormBALL
- J-STD-609 Codee0
- Memory IC TypeDDR SRAM
- Operating ModeSYNCHRONOUS
- Parallel/SerialPARALLEL
- Terminal FinishTin/Lead (Sn/Pb)
- DLA QualificationNot Qualified
- Temperature GradeCOMMERCIAL
- Terminal PositionBOTTOM
- Additional FeaturePIPELINED ARCHITECTURE
- Memory Organization512KX36
- Number of Functions1
- Number of Terminals165
- Terminal Pitch (mm)1.000
- Access Time-Max (ns)0.4500000000000000
- Number of Words Code512K
- Memory Density (bits)18874368.0000000000000000
- Package Body MaterialPLASTIC/EPOXY
- Output Characteristics3-STATE
- Seated Height-Max (mm)1.4000
- Supply Voltage-Max (V)1.90000
- Supply Voltage-Min (V)1.70000
- Supply Voltage-Nom (V)1.8
- Number of Words (words)524288.0000000000000000
- Standby Current-Max (A)0.300000000000000
- Standby Voltage-Min (V)1.700000
- Supply Current-Max (mA)635.000000000000000
- Package Equivalence CodeBGA165,11X15,40
- Clock Frequency-Max (MHz)200.00000
- Moisture Sensitivity Level3
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Operating Temperature-Max (Cel)70.0
- Operating Temperature-Min (Cel)0.0
- Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
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