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CS18LV40963KI-70

Chiplus Semiconductor Corp.

Chiplus Semiconductor Corp. CS18LV40963KI-70
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B36
  • Memory Width
    8
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Memory IC Type
    STANDARD SRAM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    512KX8
  • Number of Terminals
    36
  • Terminal Pitch (mm)
    0.75
  • Access Time-Max (ns)
    70
  • Number of Words Code
    512K
  • Memory Density (bits)
    4194304
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Number of Words (words)
    524288
  • Standby Voltage-Min (V)
    1.5
  • Supply Current-Max (mA)
    30
  • Package Equivalence Code
    BGA36,6X8,30
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    235
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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