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CS18LV02563DIR55

Chiplus Semiconductor Corp.

Chiplus Semiconductor Corp. CS18LV02563DIR55
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Width
    8 mm
  • Length
    11.8 mm
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G32
  • Memory Width
    8
  • Organization
    32KX8
  • Package Code
    TSOP1
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    262144 bit
  • Memory IC Type
    STANDARD SRAM
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    0.5 mm
  • Access Time-Max
    55 ns
  • Number of Words
    32768 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    1.2 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    20 mA
  • Number of Functions
    1
  • Number of Terminals
    32
  • Standby Voltage-Min
    1.5 V
  • Number of Words Code
    32K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    TSSOP32,.56,20
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    1.8 V
  • Supply Voltage-Nom (Vsup)
    3 V
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    250

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CS18LV02563DIR55