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CH80566EC005DT

Intel Corporation

Intel Corporation CH80566EC005DT
  • ECCN
    3A991.A.1
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Speed
    1100 rpm
  • Width
    22 mm
  • Format
    FLOATING POINT
  • Length
    22 mm
  • Bit Size
    64
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B437
  • Package Code
    HBGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Terminal Pitch
    1 mm
  • Screening Level
    AEC-Q100
  • Integrated Cache
    YES
  • Address Bus Width
    28
  • Seated Height-Max
    2.792 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    IT ALSO OPERATES IN 600 MHZ AT 0.9V SUPPLY
  • Supply Voltage-Max
    1.1 V
  • Supply Voltage-Min
    0.9 V
  • Supply Voltage-Nom
    1 V
  • Number of Terminals
    437
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • External Data Bus Width
    64
  • Package Equivalence Code
    BGA437,21X21,40
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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CH80566EC005DT
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CH80566EC005DT