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CD40105BFX

Intersil Corporation

Intersil Corporation CD40105BFX
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-XDIP-T16
  • Memory Width
    4
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    OTHER FIFO
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    16X4
  • Number of Terminals
    16
  • Terminal Pitch (mm)
    2.54
  • Number of Words Code
    16
  • Package Body Material
    CERAMIC
  • Number of Words (words)
    16
  • Package Equivalence Code
    DIP16,.3
  • Clock Frequency-Max (MHz)
    1.5
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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