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BX80553920T2

Intel Corporation

Intel Corporation BX80553920T2
  • ECCN
    3A991.A.1
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Format
    FLOATING POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    34
  • Length (mm)
    34
  • Speed (MHz)
    2800
  • JESD-30 Code
    S-PBGA-N775
  • Package Code
    HLGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Low Power Mode
    YES
  • Integrated Cache
    YES
  • Address Bus Width
    36
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Number of Terminals
    775
  • Terminal Pitch (mm)
    1.17
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    4.242
  • Supply Voltage-Max (V)
    1.3
  • Supply Voltage-Min (V)
    1.2
  • Supply Voltage-Nom (V)
    1.3
  • External Data Bus Width
    64
  • Supply Current-Max (mA)
    125000
  • Package Equivalence Code
    LGA775,30X33,46/43
  • Clock Frequency-Max (MHz)
    200
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR

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BX80553920T2
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BX80553920T2