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BU8307CS

ROHM Semiconductor

ROHM Semiconductor BU8307CS
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    7.62
  • Length (mm)
    19.4
  • JESD-30 Code
    R-PDIP-T22
  • Package Code
    SDIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE, SHRINK PITCH Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e3/e2
  • Telecom IC Type
    TELEPHONE DIALER CIRCUIT
  • Terminal Finish
    TIN/TIN COPPER
  • Make-break Ratio
    1:1.5
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Additional Feature
    SELECTABLE MAKE/BREAK RATIO 1:2
  • Number of Functions
    1
  • Number of Terminals
    22
  • Terminal Pitch (mm)
    1.778
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    4.25
  • Supply Voltage-Nom (V)
    5
  • Supply Current-Max (mA)
    0.001
  • Package Equivalence Code
    SDIP22,.3
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    60
  • Operating Temperature-Min (Cel)
    -10
  • Time@Peak Reflow Temperature-Max (s)
    10

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BU8307CS
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BU8307CS