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BU7962GUW

ROHM Semiconductor

BU7962GUW 产品规格书
ROHM Semiconductor BU7962GUW
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    5
  • Length (mm)
    5
  • JESD-30 Code
    S-PBGA-B63
  • Package Code
    VFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • DLA Qualification
    Not Qualified
  • Interface IC Type
    INTERFACE CIRCUIT
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    63
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    0.9
  • Supply Voltage-Max (V)
    1.95
  • Supply Voltage-Min (V)
    1.65
  • Supply Voltage-Nom (V)
    1.8
  • Supply Voltage1-Max (V)
    3.6
  • Supply Voltage1-Min (V)
    1.65
  • Supply Voltage1-Nom (V)
    1.8
  • Package Equivalence Code
    BGA63,8X8,20
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -30

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