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BU7876GLS

ROHM Semiconductor

ROHM Semiconductor BU7876GLS
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width
    3 mm
  • Length
    3 mm
  • JESD-30 Code
    S-PBGA-BU12
  • Package Code
    VFBGA
  • JESD-609 Code
    e3/e2
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BUTT
  • Terminal Pitch
    0.8 mm
  • Terminal Finish
    TIN/TIN COPPER
  • Interface IC Type
    INTERFACE CIRCUIT
  • Seated Height-Max
    1 mm
  • Terminal Position
    BOTTOM
  • Supply Voltage-Max
    3.3 V
  • Supply Voltage-Min
    2.4 V
  • Supply Voltage-Nom
    3 V
  • Number of Functions
    1
  • Number of Terminals
    12
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    10

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BU7876GLS
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BU7876GLS