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BU24025MWV

ROHM Semiconductor

ROHM Semiconductor BU24025MWV
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    6
  • Length (mm)
    6
  • JESD-30 Code
    S-XQCC-N44
  • Package Code
    HVQCCN
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • J-STD-609 Code
    e2
  • Terminal Finish
    Tin/Copper (Sn/Cu)
  • DLA Qualification
    Not Qualified
  • Interface IC Type
    INTERFACE CIRCUIT
  • Temperature Grade
    OTHER
  • Terminal Position
    QUAD
  • Number of Functions
    1
  • Number of Terminals
    44
  • Terminal Pitch (mm)
    0.4
  • Package Body Material
    UNSPECIFIED
  • Seated Height-Max (mm)
    1
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3
  • Supply Voltage1-Max (V)
    5.5
  • Supply Voltage1-Min (V)
    2.7
  • Supply Voltage1-Nom (V)
    5
  • Package Equivalence Code
    LCC44,.24SQ,16
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -10

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BU24025MWV