TDK Corporation B30921D7022Y918 | 搜芯易Sourcengine

TDK Corporation B30921D7022Y918

生命周期状态
Discontinued
说明
Wireless LAN Circuit, CMOS
类别
Semiconductors Telecom ICs Network Interfaces WIRELESS LAN CIRCUIT

HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Technology
CMOS
Width (mm)
9.3
Length (mm)
10.5
JESD-30 Code
R-XBGA-B168
Package Code
BGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Telecom IC Type
WIRELESS LAN CIRCUIT
Temperature Grade
OTHER
Terminal Position
BOTTOM
Number of Functions
1
Number of Terminals
168
Package Body Material
UNSPECIFIED
Seated Height-Max (mm)
1.4
Supply Voltage-Nom (V)
1.8
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-30