TDK Corporation B30911D7021Y918 | 搜芯易Sourcengine

TDK Corporation B30911D7021Y918

生命周期状态
Active-Unconfirmed
REACH
REACH compliant
说明
Wireless LAN Circuit, CMOS
类别
Semiconductors Telecom ICs Network Interfaces WIRELESS LAN CIRCUIT

HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Width
9.3 mm
Length
10.5 mm
Technology
CMOS
JESD-30 Code
R-XBGA-B168
Package Code
LFLGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BUTT
Terminal Pitch
0.7 mm
Telecom IC Type
WIRELESS LAN CIRCUIT
Seated Height-Max
1.4 mm
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Supply Voltage-Nom
1.8 V
Number of Functions
1
Number of Terminals
168
Package Body Material
UNSPECIFIED
Operating Temperature-Max
85 Cel
Operating Temperature-Min
-40 Cel