Texas Instruments Incorporated AM3354BZCE60R | 搜芯易Sourcengine

Texas Instruments Incorporated AM3354BZCE60R

生命周期状态
Active
RoHS
符合RoHS标准
REACH
REACH compliant
说明
32-bit Processor
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs SoC

ECCN
5A992.C
ECCN Governance
EAR
HTS Code
8542.31.00.30
SB Code
8542.31.00.30

Technology
CMOS
Width (mm)
13
Length (mm)
13
JESD-30 Code
S-PBGA-B298
Package Code
LFBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Terminal Position
BOTTOM
Additional Feature
ALSO OPERATES AT MIN 0.912 V
Number of Terminals
298
Terminal Pitch (mm)
0.65
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1.3
Supply Voltage-Max (V)
1.144
Supply Voltage-Min (V)
1.056
Supply Voltage-Nom (V)
1.1
Package Equivalence Code
BGA298,19X19,25
Moisture Sensitivity Level
3
uPs/uCs/Peripheral ICs Type
SoC
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
90
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
30