Texas Instruments Incorporated AM2612AOFFHIZFGR | 搜芯易Sourcengine

Texas Instruments Incorporated AM2612AOFFHIZFGR

生命周期状态
Active
RoHS
符合RoHS标准
REACH
REACH compliant
说明
Dual-Core Arm Cortex MCU
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs SoC

ECCN
5A992.C
ECCN Governance
EAR
HTS Code
8542.31.00.30
SB Code
8542.31.00.30

Technology
CMOS
Width (mm)
13.25
Length (mm)
13.25
JESD-30 Code
S-PBGA-B304
Package Code
LFBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Position
BOTTOM
Number of Terminals
304
Terminal Pitch (mm)
0.65
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1.3
Supply Voltage-Max (V)
1.32
Supply Voltage-Min (V)
1.188
Supply Voltage-Nom (V)
1.25
Package Equivalence Code
BGA304,20X20,25
Moisture Sensitivity Level
3
uPs/uCs/Peripheral ICs Type
SoC
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-40
Screening Level / Reference Standard
AEC-Q100; ISO 26262-ASIL D
Time@Peak Reflow Temperature-Max (s)
30