AGFA006R24C1I3E

Intel Corporation

Intel Corporation AGFA006R24C1I3E
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.70
  • JESD-30 Code
    R-PBGA-B2340
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    2340
  • Package Body Material
    PLASTIC/EPOXY
  • uPs/uCs/Peripheral ICs Type
    SoC FPGA
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40

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