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74LVC1G17QDBVRQ1G4

Texas Instruments Incorporated

Texas Instruments Incorporated 74LVC1G17QDBVRQ1G4
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.90
  • SB Code
    8542.39.00.60
  • Family
    LVC/LCX/Z
  • Technology
    CMOS
  • Width (mm)
    1.6
  • Length (mm)
    2.9
  • JESD-30 Code
    R-PDSO-G5
  • Package Code
    LSSOP
  • Logic IC Type
    BUFFER
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e4
  • Packing Method
    TR, 7 INCH
  • Schmitt Trigger
    YES
  • Terminal Finish
    Nickel/Palladium/Gold (Ni/Pd/Au)
  • Number of Inputs
    1
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    5
  • Terminal Pitch (mm)
    0.95
  • Load Capacitance (pF)
    50
  • Package Body Material
    PLASTIC/EPOXY
  • Propagation Delay (ns)
    14
  • Seated Height-Max (mm)
    1.45
  • Supply Voltage-Max (V)
    6.5
  • Supply Voltage-Min (V)
    1.65
  • Supply Voltage-Nom (V)
    3.3
  • Supply Current-Max (mA)
    0.02
  • Package Equivalence Code
    TSOP5/6,.11,37
  • Moisture Sensitivity Level
    1
  • Output Low Current-Max (mA)
    32
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Propagation Delay-Max@Nom-Sup (ns)
    8
  • Screening Level / Reference Standard
    AEC-Q100
  • Time@Peak Reflow Temperature-Max (s)
    30

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