Integrated Device Technology, Inc. 72V81L20PAI | 搜芯易Sourcengine

Integrated Device Technology, Inc. 72V81L20PAI

生命周期状态
Transferred
说明
TSSOP 14.00x6.10x1.00 mm 0.50mm Pitch
类别
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
JESD-30 Code
R-PDSO-G56
Memory Width
9
Organization
1KX9
Package Code
TSSOP
JESD-609 Code
e0
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory Density
9216 bit
Memory IC Type
OTHER FIFO
Operating Mode
ASYNCHRONOUS
Terminal Pitch
0.5 mm
Access Time-Max
20 ns
Number of Words
1024 words
Terminal Finish
TIN LEAD
Temperature Grade
INDUSTRIAL
Terminal Position
DUAL
Supply Current-Max
100 mA
Number of Terminals
56
Standby Current-Max
0.005 Amp
Number of Words Code
1K
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
TSSOP56,.3,20
Operating Temperature-Max
85 Cel
Operating Temperature-Min
-40 Cel
Supply Voltage-Nom (Vsup)
3.3 V
Clock Frequency-Max (fCLK)
33.3 MHz
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
20