Integrated Device Technology, Inc. 72V51556L6BB8 | 搜芯易Sourcengine

Integrated Device Technology, Inc. 72V51556L6BB8

生命周期状态
Transferred
说明
PBGA 17.00x17.00x1.76 mm 1.00mm Pitch
类别
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
JESD-30 Code
S-PBGA-B256
Memory Width
36
Organization
64KX36
Package Code
BGA
JESD-609 Code
e0
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
2359296 bit
Memory IC Type
OTHER FIFO
Operating Mode
SYNCHRONOUS
Terminal Pitch
1 mm
Access Time-Max
3.7 ns
Number of Words
65536 words
Terminal Finish
TIN LEAD
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Supply Current-Max
100 mA
Number of Terminals
256
Standby Current-Max
0.01 Amp
Number of Words Code
64K
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
BGA256,16X16,40
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Nom (Vsup)
3.3 V
Clock Frequency-Max (fCLK)
166 MHz
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Time@Peak Reflow Temperature-Max (s)
30