Integrated Device Technology, Inc. 72V2103L6PF | 搜芯易Sourcengine

Integrated Device Technology, Inc. 72V2103L6PF

生命周期状态
Transferred
说明
TQFP 14.00x14.00x1.40 mm 0.65mm Pitch
类别
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
Width (mm)
14
Length (mm)
14
JESD-30 Code
S-PQFP-G80
Memory Width
18
Package Code
LQFP
Output Enable
YES
Package Shape
SQUARE
Package Style
FLATPACK, LOW PROFILE Meter
Surface Mount
YES
Terminal Form
GULL WING
J-STD-609 Code
e0
Memory IC Type
OTHER FIFO
Operating Mode
SYNCHRONOUS
Cycle Time (ns)
6
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Additional Feature
ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE
Memory Organization
128KX18
Number of Functions
1
Number of Terminals
80
Terminal Pitch (mm)
0.65
Access Time-Max (ns)
4
Number of Words Code
128K
Memory Density (bits)
2359296
Package Body Material
PLASTIC/EPOXY
Alternate Memory Width
9
Seated Height-Max (mm)
1.6
Supply Voltage-Max (V)
3.45
Supply Voltage-Min (V)
3.15
Supply Voltage-Nom (V)
3.3
Number of Words (words)
131072
Standby Current-Max (A)
0.015
Supply Current-Max (mA)
35
Package Equivalence Code
QFP80,.64SQ
Clock Frequency-Max (MHz)
166
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
240
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
20