Integrated Device Technology, Inc. 72V205L15PF | 搜芯易Sourcengine

Integrated Device Technology, Inc. 72V205L15PF

生命周期状态
Transferred
说明
TQFP 14.00x14.00x1.40 mm 0.80mm Pitch
类别
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Width
14 mm
Length
14 mm
Cycle Time
15 ns
Technology
CMOS
JESD-30 Code
S-PQFP-G64
Memory Width
18
Organization
256X18
Package Code
LQFP
JESD-609 Code
e0
Output Enable
YES
Package Shape
SQUARE
Package Style
FLATPACK, LOW PROFILE Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory Density
4608 bit
Memory IC Type
OTHER FIFO
Operating Mode
SYNCHRONOUS
Terminal Pitch
0.8 mm
Access Time-Max
10 ns
Number of Words
256 words
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
Seated Height-Max
1.6 mm
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Additional Feature
EASILY EXPANDABLE IN DEPTH AND WIDTH
Number of Functions
1
Number of Terminals
64
Standby Current-Max
0.005 Amp
Number of Words Code
256
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
QFP64,.66SQ,32
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V
Clock Frequency-Max (fCLK)
66.7 MHz
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
30