Integrated Device Technology, Inc. 72V19320L10BBI | 搜芯易Sourcengine

Integrated Device Technology, Inc. 72V19320L10BBI

生命周期状态
Discontinued
说明
FIFO, 32KX32, 6.5ns, Synchronous/Asynchronous, CMOS, PBGA144
类别
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
JESD-30 Code
S-PBGA-B144
Memory Width
32
Package Code
BGA
Output Enable
YES
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Memory IC Type
OTHER FIFO
Operating Mode
SYNCHRONOUS/ASYNCHRONOUS
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn63Pb37)
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Memory Organization
32KX32
Number of Functions
1
Number of Terminals
144
Terminal Pitch (mm)
1
Access Time-Max (ns)
6.5
Number of Words Code
32K
Memory Density (bits)
1048576
Package Body Material
PLASTIC/EPOXY
Supply Voltage-Nom (V)
3.3
Number of Words (words)
32768
Standby Current-Max (A)
0.015
Supply Current-Max (mA)
40
Package Equivalence Code
BGA144,12X12,40
Clock Frequency-Max (MHz)
100
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
30