Integrated Device Technology, Inc. 72V16160L10BBI | 搜芯易Sourcengine

Integrated Device Technology, Inc. 72V16160L10BBI

生命周期状态
Discontinued
说明
FIFO, 8KX16, 6.5ns, Synchronous/Asynchronous, CMOS, PBGA144
类别
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
JESD-30 Code
S-PBGA-B144
Memory Width
16
Organization
8KX16
Package Code
BGA
JESD-609 Code
e0
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
131072 bit
Memory IC Type
OTHER FIFO
Operating Mode
SYNCHRONOUS/ASYNCHRONOUS
Terminal Pitch
1 mm
Access Time-Max
6.5 ns
Number of Words
8192 words
Terminal Finish
TIN LEAD
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Supply Current-Max
40 mA
Number of Terminals
144
Standby Current-Max
0.015 Amp
Number of Words Code
8K
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
BGA144,12X12,40
Operating Temperature-Max
85 Cel
Operating Temperature-Min
-40 Cel
Supply Voltage-Nom (Vsup)
3.3 V
Clock Frequency-Max (fCLK)
100 MHz
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Time@Peak Reflow Temperature-Max (s)
30