Integrated Device Technology, Inc. 72V06L35JG | 搜芯易Sourcengine

Integrated Device Technology, Inc. 72V06L35JG

生命周期状态
Transferred
RoHS
符合RoHS标准
REACH
REACH compliant
说明
FIFO, 16KX9, 35ns, Asynchronous, CMOS, PQCC32
类别
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
Width (mm)
11.455
Length (mm)
13.995
JESD-30 Code
R-PQCC-J32
Memory Width
9
Package Code
QCCJ
Output Enable
NO
Package Shape
RECTANGULAR
Package Style
CHIP CARRIER Meter
Surface Mount
YES
Terminal Form
J BEND
J-STD-609 Code
e3
Memory IC Type
OTHER FIFO
Operating Mode
ASYNCHRONOUS
Cycle Time (ns)
45
Parallel/Serial
PARALLEL
Terminal Finish
Matte Tin (Sn) - annealed
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Memory Organization
16KX9
Number of Functions
1
Number of Terminals
32
Terminal Pitch (mm)
1.27
Access Time-Max (ns)
35
Number of Words Code
16K
Memory Density (bits)
147456
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
3.556
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
3
Supply Voltage-Nom (V)
3.3
Number of Words (words)
16384
Standby Current-Max (A)
0.005
Supply Current-Max (mA)
75
Package Equivalence Code
LDCC32,.5X.6
Clock Frequency-Max (MHz)
22.2
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
30