Integrated Device Technology, Inc. 72T54252L6-7BB | 搜芯易Sourcengine

Integrated Device Technology, Inc. 72T54252L6-7BB

生命周期状态
Transferred
说明
PBGA 19.00x19.00x1.76 mm 1.00mm Pitch
类别
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Width
19 mm
Length
19 mm
Cycle Time
6.7 ns
Technology
CMOS
JESD-30 Code
S-PBGA-B324
Memory Width
20
Organization
64KX20
Package Code
BGA
JESD-609 Code
e0
Output Enable
YES
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
1310720 bit
Memory IC Type
OTHER FIFO
Operating Mode
SYNCHRONOUS
Terminal Pitch
1 mm
Access Time-Max
3.8 ns
Number of Words
65536 words
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
Seated Height-Max
1.97 mm
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Additional Feature
CAN ALSO BE CONFIGURED AS 65,536 X 10 X 4
Supply Current-Max
350 mA
Number of Functions
1
Number of Terminals
324
Standby Current-Max
0.015 Amp
Number of Words Code
64K
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Alternate Memory Width
10
Package Equivalence Code
BGA324,18X18,40
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Max (Vsup)
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
Clock Frequency-Max (fCLK)
150 MHz
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Time@Peak Reflow Temperature-Max (s)
30