Integrated Device Technology, Inc. 72T3645L5BB | 搜芯易Sourcengine

Integrated Device Technology, Inc. 72T3645L5BB

生命周期状态
Transferred
说明
PBGA 17.00x17.00x1.76 mm 1.00mm Pitch
类别
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Width
17 mm
Length
17 mm
Cycle Time
5 ns
Technology
CMOS
JESD-30 Code
S-PBGA-B208
Memory Width
36
Organization
1KX36
Package Code
BGA
JESD-609 Code
e0
Output Enable
YES
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
36864 bit
Memory IC Type
OTHER FIFO
Operating Mode
SYNCHRONOUS
Terminal Pitch
1 mm
Access Time-Max
3.6 ns
Number of Words
1024 words
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
Seated Height-Max
1.97 mm
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Additional Feature
ASYNCHRONOUS OPERATION ALSO POSSIBLE
Supply Current-Max
60 mA
Number of Functions
1
Number of Terminals
208
Standby Current-Max
0.01 Amp
Number of Words Code
1K
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
BGA208,16X16,40
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Max (Vsup)
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
Clock Frequency-Max (fCLK)
200 MHz
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Time@Peak Reflow Temperature-Max (s)
30