Integrated Device Technology, Inc. 72T20128L6-7BBI | 搜芯易Sourcengine

Integrated Device Technology, Inc. 72T20128L6-7BBI

生命周期状态
Transferred
说明
PBGA 17.00x17.00x1.76 mm 1.00mm Pitch
类别
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
JESD-30 Code
S-PBGA-B208
Memory Width
20
Package Code
BGA
Output Enable
YES
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Memory IC Type
OTHER FIFO
Operating Mode
SYNCHRONOUS
Cycle Time (ns)
7
Parallel/Serial
SERIAL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Memory Organization
256KX20
Number of Functions
1
Number of Terminals
208
Terminal Pitch (mm)
1
Access Time-Max (ns)
3.8
Number of Words Code
256K
Memory Density (bits)
5242880
Package Body Material
PLASTIC/EPOXY
Alternate Memory Width
10
Supply Voltage-Nom (V)
2.5
Number of Words (words)
262144
Standby Current-Max (A)
0.05
Supply Current-Max (mA)
60
Package Equivalence Code
BGA208,16X16,40
Clock Frequency-Max (MHz)
150
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
30