Integrated Device Technology, Inc. 72T1885L5BBG
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Width
    13 mm
  • Length
    13 mm
  • Cycle Time
    5 ns
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B144
  • Memory Width
    18
  • Organization
    32KX18
  • Package Code
    BGA
  • JESD-609 Code
    e1
  • Output Enable
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    589824 bit
  • Memory IC Type
    OTHER FIFO
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Access Time-Max
    3.6 ns
  • Number of Words
    32768 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN SILVER COPPER
  • Seated Height-Max
    1.97 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE
  • Supply Current-Max
    60 mA
  • Number of Functions
    1
  • Number of Terminals
    144
  • Standby Current-Max
    0.05 Amp
  • Number of Words Code
    32K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    9
  • Package Equivalence Code
    BGA144,12X12,40
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    2.625 V
  • Supply Voltage-Min (Vsup)
    2.375 V
  • Supply Voltage-Nom (Vsup)
    2.5 V
  • Clock Frequency-Max (fCLK)
    83 MHz
  • Moisture Sensitivity Level
    3

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