Integrated Device Technology, Inc. 72T1885L10BB | 搜芯易Sourcengine

Integrated Device Technology, Inc. 72T1885L10BB

生命周期状态
Discontinued
说明
FIFO, 32KX18, 14ns, Synchronous/Asynchronous, CMOS, PBGA144
类别
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
JESD-30 Code
S-PBGA-B144
Memory Width
18
Organization
32KX18
Package Code
BGA
JESD-609 Code
e0
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
589824 bit
Memory IC Type
OTHER FIFO
Operating Mode
SYNCHRONOUS/ASYNCHRONOUS
Terminal Pitch
1 mm
Access Time-Max
14 ns
Number of Words
32768 words
Terminal Finish
TIN LEAD
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Supply Current-Max
60 mA
Number of Terminals
144
Standby Current-Max
0.05 Amp
Number of Words Code
32K
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Alternate Memory Width
9
Package Equivalence Code
BGA144,12X12,40
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Nom (Vsup)
2.5 V
Clock Frequency-Max (fCLK)
50 MHz
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Time@Peak Reflow Temperature-Max (s)
30