Integrated Device Technology, Inc. 72P51767L7-5BBI | 搜芯易Sourcengine

Integrated Device Technology, Inc. 72P51767L7-5BBI

生命周期状态
Transferred
说明
PBGA 23.00x23.00x2.23 mm 1.00mm Pitch
类别
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
JESD-30 Code
S-PBGA-B376
Memory Width
40
Organization
128KX40
Package Code
BGA
JESD-609 Code
e0
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
5242880 bit
Memory IC Type
OTHER FIFO
Operating Mode
ASYNCHRONOUS
Terminal Pitch
1 mm
Access Time-Max
3.8 ns
Number of Words
131072 words
Terminal Finish
TIN LEAD
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Supply Current-Max
200 mA
Number of Terminals
376
Standby Current-Max
0.12 Amp
Number of Words Code
128K
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
BGA376,22X22,40
Operating Temperature-Max
85 Cel
Operating Temperature-Min
-40 Cel
Supply Voltage-Nom (Vsup)
1.8 V
Clock Frequency-Max (fCLK)
133 MHz
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225