Integrated Device Technology, Inc. 7281L15PAG | 搜芯易Sourcengine

Integrated Device Technology, Inc. 7281L15PAG

生命周期状态
Transferred
RoHS
符合RoHS标准
REACH
REACH compliant
说明
TSSOP 6.1 MM 0.5MM PITCH
类别
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
Width (mm)
6.1
Length (mm)
14
JESD-30 Code
R-PDSO-G56
Memory Width
9
Package Code
TSSOP
Output Enable
NO
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
J-STD-609 Code
e3
Memory IC Type
OTHER FIFO
Operating Mode
ASYNCHRONOUS
Cycle Time (ns)
25
Parallel/Serial
PARALLEL
Terminal Finish
Matte Tin (Sn) - annealed
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
DUAL
Additional Feature
RETRANSMIT
Memory Organization
512X9
Number of Functions
1
Number of Terminals
56
Terminal Pitch (mm)
0.5
Access Time-Max (ns)
15
Number of Words Code
512
Memory Density (bits)
4608
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1.2
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
512
Standby Current-Max (A)
0.015
Supply Current-Max (mA)
125
Package Equivalence Code
TSSOP56,.3,20
Clock Frequency-Max (MHz)
40
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
30