Integrated Device Technology, Inc. 72225LB35PF | 搜芯易Sourcengine

Integrated Device Technology, Inc. 72225LB35PF

生命周期状态
Discontinued
说明
FIFO, 1KX18, 20ns, Synchronous, CMOS, PQFP64
类别
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
JESD-30 Code
S-PQFP-G64
Memory Width
18
Organization
1KX18
Package Code
QFP
JESD-609 Code
e0
Package Shape
SQUARE
Package Style
FLATPACK Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory Density
18432 bit
Memory IC Type
OTHER FIFO
Operating Mode
SYNCHRONOUS
Terminal Pitch
0.8 mm
Access Time-Max
20 ns
Number of Words
1024 words
Terminal Finish
TIN LEAD
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Supply Current-Max
60 mA
Number of Terminals
64
Standby Current-Max
0.005 Amp
Number of Words Code
1K
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
QFP64,.66SQ,32
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Nom (Vsup)
5 V
Clock Frequency-Max (fCLK)
28.6 MHz
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
30