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72205LB10TF9

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 72205LB10TF9
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • Width (mm)
    10
  • Length (mm)
    10
  • JESD-30 Code
    S-PQFP-G64
  • Memory Width
    9
  • Package Code
    LFQFP
  • Output Enable
    NO
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Memory IC Type
    OTHER FIFO
  • Operating Mode
    ASYNCHRONOUS
  • Cycle Time (ns)
    50
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Memory Organization
    4KX9
  • Number of Functions
    1
  • Number of Terminals
    64
  • Terminal Pitch (mm)
    0.5
  • Access Time-Max (ns)
    40
  • Number of Words Code
    4K
  • Memory Density (bits)
    36864
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.6
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    256
  • Supply Current-Max (mA)
    150
  • Moisture Sensitivity Level
    3
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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72205LB10TF9
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72205LB10TF9