Integrated Device Technology, Inc. 7202LA30PB | 搜芯易Sourcengine

Integrated Device Technology, Inc. 7202LA30PB

生命周期状态
Transferred
说明
FIFO, 1KX9, 20ns, Asynchronous, CMOS, PDIP28
类别
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
JESD-30 Code
R-PDIP-T28
Memory Width
9
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE Meter
Surface Mount
NO
Terminal Form
THROUGH-HOLE
J-STD-609 Code
e0
Memory IC Type
OTHER FIFO
Operating Mode
ASYNCHRONOUS
Terminal Finish
Tin/Lead (Sn85Pb15)
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
DUAL
Memory Organization
1KX9
Number of Terminals
28
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
20
Number of Words Code
1K
Memory Density (bits)
9216
Package Body Material
PLASTIC/EPOXY
Supply Voltage-Nom (V)
5
Number of Words (words)
1024
Standby Current-Max (A)
0.015
Supply Current-Max (mA)
100
Package Equivalence Code
DIP28,.6
Clock Frequency-Max (MHz)
33.3
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
240
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Screening Level / Reference Standard
38535Q/M;38534H;883B
Time@Peak Reflow Temperature-Max (s)
20