Integrated Device Technology, Inc. 7200L25JG8 | 搜芯易Sourcengine

Integrated Device Technology, Inc. 7200L25JG8

生命周期状态
Discontinued
RoHS
符合RoHS标准
REACH
REACH compliant
说明
FIFO, 256X9, 25ns, Asynchronous, CMOS, PQCC32
类别
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
Width (mm)
11.4554
Length (mm)
13.9954
JESD-30 Code
R-PQCC-J32
Memory Width
9
Package Code
QCCJ
Output Enable
NO
Package Shape
RECTANGULAR
Package Style
CHIP CARRIER Meter
Surface Mount
YES
Terminal Form
J BEND
J-STD-609 Code
e3
Memory IC Type
OTHER FIFO
Operating Mode
ASYNCHRONOUS
Cycle Time (ns)
35
Parallel/Serial
PARALLEL
Terminal Finish
Matte Tin (Sn) - annealed
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Memory Organization
256X9
Number of Functions
1
Number of Terminals
32
Terminal Pitch (mm)
1.27
Access Time-Max (ns)
25
Number of Words Code
256
Memory Density (bits)
2304
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
3.556
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
256
Standby Current-Max (A)
0.005
Supply Current-Max (mA)
80
Package Equivalence Code
LDCC32,.5X.6
Clock Frequency-Max (MHz)
28.5
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
30